Wafer Dicing Protective Film
- Standard wafer sizes:4 inch, 6 inch, 8 inch, 12 inch
- Film color:Blue transparent or clear
- Backing material:PO, PVC, or PET-based film
- Adhesive type:UV-sensitive acrylic adhesive
- Process use:Wafer mounting, blade dicing, irradiation, die pick-up
- Clean packaging:Individual roll pack, double anti-static PE bag, lot traceable
Films Protective Company is a wafer dicing protective film manufacturer for semiconductor wafer fixing, blade dicing protection, and clean release after irradiation. The film keeps wafers stable on the dicing frame during cutting, then lowers tack for post-dicing peeling and die pick-up. It is made for 4 inch to 12 inch wafer processes that require low contamination, low adhesive residue, stable handling, and clean packaged supply.
Product Overview
This wafer dicing protective film is made for semiconductor singulation lines where the film must hold the wafer securely without making later removal difficult. During blade dicing, the wafer faces vibration, cooling water flow, cutting force, and die separation stress. A stable film helps keep the wafer attached to the ring frame while reducing die movement, edge chipping, flying chips, and unstable cut paths.
The product is a process-grade wafer dicing tape, not a general surface protection film. Its value comes from adhesion balance. Before exposure, typical grades provide about 1.0-3.5 N/25 mm peel adhesion on silicon mirror wafer, giving enough holding force for thin wafers, bumped wafers, and fragile substrates. After irradiation, adhesion can drop to about 0.05-0.35 N/25 mm, supporting lower-stress removal with reduced residue transfer to the wafer back side, die edges, and frame contact area.
Benefits
- Stable wafer fixing:Keeps semiconductor wafers firmly mounted on the dicing frame during blade cutting.
- Controlled release:Typical 365 nm irradiation changes the adhesive to a lower-tack state for smoother peeling.
- Lower residue risk:Helps reduce transfer to the wafer back side, die edges, and frame contact area.
- Cleaner handling:Low-particle processing, clean roll handling, and protected packaging reduce contamination risk.
- Support for delicate substrates:Suitable for thin wafers, bumped wafers, MEMS, LED, and compound semiconductor substrates.
- Flexible process fit:Available for 4 inch, 6 inch, 8 inch, and 12 inch wafer dicing operations.
How Does Controlled Release Improve the Dicing Process?
Controlled release matters because wafer dicing needs two adhesion states in one material. During cutting, the adhesive holds the wafer and separated dies against blade vibration, cooling water flow, and cutting force. After irradiation, usually around 365 nm and 1000-2000 mJ/cm2 depending on tape grade and equipment, the adhesive loses part of its tack. This makes die pick-up cleaner and more predictable, especially for thin wafers, fine-pitch dies, and fragile semiconductor components where high peeling force may cause cracking, residue transfer, or picking failure.
Production Line
TDS
Item | Typical Value |
Product type | UV release wafer dicing protective film |
Related product name | Wafer dicing tape, UV release dicing tape |
Backing film | PO, PVC, or PET-based film |
Adhesive system | UV-sensitive acrylic adhesive |
Release liner | PET release liner |
Film color | Blue transparent or clear |
Total thickness | 80 um-150 um |
Adhesive thickness | 10 um-30 um |
Before exposure peel adhesion | 1.0-3.5 N/25 mm on silicon mirror wafer |
After exposure peel adhesion | 0.05-0.35 N/25 mm on silicon mirror wafer |
Typical wavelength | 365 nm |
Typical dosage | 1000-2000 mJ/cm2, depending on tape grade and equipment |
Wafer size compatibility | 4 inch, 6 inch, 8 inch, 12 inch |
Heat resistance during process | 60 C short-term handling |
Residue performance | Low residue after irradiation and controlled peeling |
Cleanliness control | Low particle handling, clean roll processing |
Packaging | Individual roll pack, double anti-static PE bag, lot number label |
Storage condition | 15 C-30 C, dry and light-protected environment |
Shelf life | 6 months typical under recommended storage |
How to Match the Film to a Wafer Dicing Process?
A wafer dicing protective film should be matched to the actual dicing process, not selected by thickness alone. Key checks include initial peel adhesion, release force after irradiation, backing flexibility, residue level, wafer size, and dicing frame compatibility. A grade with too much adhesion may cut well but create pick-up stress later. A grade with weak initial tack may allow die shift, unstable cutting, or incomplete die support. Clean packaging, double anti-static PE bags, and lot number labels also reduce contamination risk before wafer mounting and support process review.
Applications
- Semiconductor wafer dicing and die singulation
- Silicon wafer mounting on dicing frame
- Thin wafer and fragile die cutting support
- Bumped wafer, MEMS, LED, and sensor wafer processing
- GaAs, sapphire, ceramic, and compound semiconductor substrate dicing
- Post-dicing release, die pick-up, and clean peeling processes
Loading Details
FAQ
Q1: What is this film used for?
It fixes semiconductor wafers on a dicing frame, protects them during cutting, and releases cleanly after irradiation.
Q2: Does it support 12 inch wafers?
Yes. Typical sizes cover 4 inch, 6 inch, 8 inch, and 12 inch wafer processes, depending on roll width and frame requirements.
Q3: Will it leave adhesive residue after dicing?
The adhesive is designed for low residue after proper irradiation and controlled peeling, especially on the wafer back side and die edges.
Q4: Is the film packed for semiconductor use?
Yes. Rolls are individually packed with double anti-static PE bags and lot number labels for clean handling and traceability.
