Anti Static Adhesive Film

Films Protective Company is an anti static adhesive film manufacturer making ESD process protection film for electronics production, cleanroom handling, PCB temporary masking, display panel protection, and electronic component turnover. The film controls surface resistance, reduces dust attraction, and removes with low residue during unwinding, die-cutting, transfer, and temporary lamination. It is made for static-sensitive areas where stable handling and clean removal matter more than simple surface covering.

Product Overview

This static dissipative adhesive film is made for electronics process protection, not ordinary clear surface covering. In PCB assembly, FPC transfer, LCD or OLED panel movement, and IC carrier protection, regular plastic film can become charged when peeled from a liner or removed from a part. Once charged, the film may pull dust and fibers onto sensitive surfaces, affecting inspection, bonding, testing, or the next assembly step.

The film uses a treated dissipative surface with pressure-sensitive adhesive, so it can hold temporarily while helping charge dissipate more steadily. Surface resistance can be adjusted from 10^5 to 10^11 ohms according to film grade and application surface. Lower tack grades are usually safer for PCB, coated glass, optical film, or display panels where residue risk is high. Medium tack grades are better when parts move through trays, fixtures, inspection benches, ESD-safe workstations, or turnover steps.

From factory production experience, this material should not be selected by thickness alone. Adhesive type, surface energy, dwell time, peeling angle, temperature, and storage condition all affect removal results. Roll tension, liner release, slitting edge cleanliness, and packing condition also matter in cleaner production areas. For residue-sensitive parts, the final tack grade should be confirmed on the actual component because coating type and process heat can change peeling behavior.

Benefits

• Helps reduce charge build-up during unwinding, peeling, lamination, die-cutting, and process transfer.
• Reduces particle pull toward PCB, FPC, coated glass, optical film, or electronic modules.
• Low residue adhesive grades are available, with 24h and 48h dwell testing recommended before mass use.
• Supports cleaner handling through controlled winding, protected roll edges, stable liner release, and cleaner packing.
• Thickness, tack level, color, roll width, liner structure, and surface resistance grade can be adjusted.
• This ESD adhesive film fits processes that need static control, temporary bonding, dust reduction, and clean removal together.

What should be checked before use on PCB or display panels?

Before applying anti static adhesive film to PCB, FPC, LCD, OLED panel, or electronic modules, the important checks are surface resistance stability, adhesive grade, residue after removal, and dust control. Color and roll size are only basic specifications. In our in-house sample checks, we compare 180-degree peeling after 24h and 48h dwell time on the actual test surface. If the panel has coating, printing, plasma treatment, exposed traces, or fragile edges, a lower tack grade is often the safer starting point.

TDS

Production Line

How does ESD adhesive film control dust attraction during electronics handling?

Static charge often appears when a film is unwound, peeled from a release liner, die-cut, or removed from a protected part. In an electronics workshop, this charge can pull fine dust and fibers toward PCB, panel, or module surfaces. A static dissipative adhesive film helps reduce this by allowing charge to dissipate more steadily during liner removal, panel transfer, and turnover handling. Smooth liner release, stable roll tension, clean slitting edges, and protected packing also matter because many dust issues happen during handling.

Applications

• PCB temporary masking during inspection, storage, transfer, and assembly handling.
• FPC turnover protection before bonding, testing, or packaging.
• LCD and OLED panel temporary protection during process movement and surface inspection.
• IC tray, carrier, fixture, and ESD-safe workstation surface contact protection.
• Optical film, coated glass, and display module handling where particle attraction must be reduced.
• Electronic component transfer between clean bench, testing area, assembly station, and packing step.

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FAQ

Is this film the same as ordinary transparent protective film?

No. This film is made for ESD control and electronics process protection, with controlled surface resistance, temporary adhesion, and low residue options.

Can the surface resistance be customized?

Yes. Common grades can be adjusted within 10^5-10^11 ohms after sample testing.

Will it leave adhesive residue after removal?

It is designed for low residue removal, but final results depend on surface type, dwell time, temperature, peeling angle, and peeling speed.

Can it be used in cleanroom-related production?

Yes. Roll packing, edge protection, winding tension, and liner release can be adjusted to reduce particle transfer.